单颗磨粒切厚均匀化实现脆性材料延性域磨削技术

Ductile Regime Grinding of Brittle Material with Unifying Undeformed Chip Thickness of Grain Cutting Edge

脆性材料磨削加工中容易出现表面亚表面损伤等质量问题,而且加工效率较低,这已经成为脆性材料产品大规模商品化生产的瓶颈。本文提出了一种新的工艺构想,即采用磨粒有序排布的砂轮及其精细的修整工艺实现单颗磨粒切厚均匀化,使得每颗磨粒都处于脆性材料的延性加工状态,从而实现脆性材料的延性域磨削。基于此构想,制作了磨粒有序排布的单层钎焊超硬磨料砂轮,并进行了一系列的修整和磨削试验,最后实现了氧化锆陶瓷的延性域磨削。实验证明该工艺方法可行,有效且可操作。

In grinding of brittle materials, it is easy to produce quality problem such as surface/subsurface damage during machining and the machining efficiency is low. This can be a bottleneck of the commercial mass production of brittle materials. The paper proposes a new process principle, which uses the grinding tool with orderly distributed grains and precision dressing to unify the undeformed chip thickness. From this method, every grain can be made suitable for ductile cutting, then the ductile grinding can be realized. Accordingly, the paper produces monolayer brazed super abrasive grinding tools, and conducts a series of experiment including dressing and grinding. Finally, a ductile surface of Zirconia ceramic is achieved. The experiment proves that this process principle is liable, effective and operable.