摘要
通过对电子产品的装联中镀金引线表面产生"金脆"的机理和过程的分析,对"去金"问题以及对可靠性的影响进行了探讨。结合航天产品的相关工艺规范的要求,提出了具体的"去金"工艺措施,并进行了工艺方法的探讨。结果表明,元器件去金提高了焊点的可靠性,但对于元器件引线的"去金"问题应慎重对待。
This paper analyzes the mechanism and course of ＂Au-brittle＂ in the soldering in assemblies and discusses ＂degolding＂ and reliability influence of Au-Sn alloy. Linking with the correlation process requirements for pru- ducts of spacecraft, some idiographic measure of ＂degolding＂ is put forward and discussed. The reliability of components soldering should be increased by degolding, but must carefulness in process.
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2012年第5期84-87,共4页
Aerospace Materials & Technology
关键词
去金
元器件
焊接
工艺
De-golding, Component, Soldering, Process
