摘要
采用真空扩散连接工艺对Cu/Al异种材料进行连接,焊后利用扫描电镜和EDS对焊接接头的微观组织及元素扩散行为进行了研究。在焊接温度为540℃、扩散时间为60 min、焊接压力为5MPa的工艺下,焊接接头最高抗拉强度为185MPa。
Aluminium alloy and copper（T2） was bonded by vacuum diffusion bonding. The microstructure features and mechanical properties of the welded joints were investigated by SEM and EDS. The results show that when the welding temperature is 540 ℃, diffusion is 60 min, welding pressure is 5 MPa, the highest tensile strength of the welded joint can reach 185 MPa.
出处
《热加工工艺》
CSCD
北大核心
2012年第21期167-168,共2页
Hot Working Technology
关键词
真空扩散连接
抗拉强度
异种材料
微观组织
vacuum diffusion bonding
tensile strength
dissimilar metals
microstructure
