DYP-40薄膜电容自动切片机的结构与特点

The Structure and Feature of DYP-40 Automatic Cutting and Clearing Machine of Stacked Capacitor Elements

在多种电子元器件中,电容器是使用面最广和用量最大的电子原件,片式薄膜电容器是由薄膜电容条切割而成,切片工艺是片式薄膜电容器生产中的关键工艺,这里着重介绍切片工艺研究内容,并根据研究所得工艺开发出的相关设备。并介绍了DYP-40大尺寸固盘式薄膜电容自动切片机的机械结构、工作原理及相关特点。

In a variety of electronic components, capacitors are the most widely used and the largest amount of electronic components. Chip film capacitor consists of a thin film capacitor cutting and slicing process, chip film capacitor production key technology. Introduces the laminated film capacitor production process. Discusses the research content and the slicing process, based on the results of technology developed the relevant equipment, the key technology equipment, puts forward the solution