摘要
在无铅组装工艺中,大多数电路板组装厂优先采用低成本焊料合金。没有添加剂的锡铜无铅焊料本身存在局限性,可是添加某种成份后,就能克服锡铜焊料通常所遇到的不足之处。文章分析了几种锡铜焊料相对于SAC焊料的特点,并叙述了它们在波峰焊和手工焊接工艺中的应用情况。
first. the the In Lead-free process, a substantial percentage of PCB assemblers select less costly solder alloys at Tin-copper solder without dopants has limitations, but the addition of certain elements helps to eliminate deficiencies normally seen with tin-copper solder. This paper discusses several tin-copper options and advantages they offer when compared with SAC based solder. And introduce how to use them in wave- soldering and hand-soldering process
出处
《电子与封装》
2012年第10期7-9,18,共4页
Electronics & Packaging
关键词
无铅工艺
锡铜焊料
波峰焊
手工焊
Lead-free process
Tin-copper solder
wave soldering
hand-soldering
