楔形扫描器在激光微加工中的应用

The Application of Rotary Wedge Scanner in Laser Micro Processing

激光在加工微米级小孔径领域中有着明显优势,尤其是在对于特殊孔形的小孔加工中,激光可以实现高精度高速度的轮廓描绘。探讨了双光楔旋转打孔激光加工系统在不锈钢、单晶硅等材料上异形孔加工成型的工艺参数,结果表明更多的重复次数在小孔加工中起着比激光能量更重要的作用。同时实验也利用旋转双光楔扫描器在不同材料表面进行了异形微孔加工,验证了双光楔系统在实际工业打孔加工应用中的可能性。

Laser is a distinguish method in micro hole processing especially for special shape hole producing achieved by high speed scanning.In this paper,Rotary wedge scanner（RWS） is employed in laser optical system in micro special shape hole processing on steel and silicon wafer.Multiplicity of process is found a more important parameter than laser density or linear speed.Also technological test for micro special shape hole processing is done on different surfaces,thus the possibility of application RWS in industry is proved.