摘要
开展Ferro金银混合导体LTCC技术研究,通过解决填孔、烧结等工艺存在的问题,实现基于金银混合导体的LTCC微波多层陶瓷基板的制备,有效地降低LTCC产品的研制生产成本。对混合导体LTCC基板银迁移效应与柯肯达尔效应展开了一系列研究,同时从混合导体LTCC基板微观结构,键合强度以及基板绝缘电阻等方面,对混合导体LTCC基板的可靠性进行了分析研究。
LTCC microwave multilayer substrate based on mixed metal material system was achieved by solving the process problem of via-fill and sinter.It is an effective way to lower the cost of LTCC product development and manufacture.We also researched on the Ag migration effect and kirkendall void of LTCC based on mixed metal material system and analysed its reliability on microstructure,bonding strength and insulting resistivity.
出处
《固体电子学研究与进展》
CAS
CSCD
北大核心
2012年第5期506-509,共4页
Research & Progress of SSE
