磁控溅射制备Zr膜的应力研究

Residual stress of Zr thin film deposited by magnetic sputtering

为了研究磁控溅射方法制备的Zr膜的应力分布情况,采用探针轮廓仪测量镀膜前后基片在1维方向上的形变,根据镀膜前后基片曲率半径的变化和Stoney公式,用自编应力计算软件计算出薄膜的内应力。结果表明,Zr膜中主要存在的是压应力,且分布不均匀;工作气压对Zr膜内应力影响不大,但膜厚对Zr膜内应力影响较大,且随膜厚的增加,Zr膜中压应力减小。

In order to study stress distribution in Zr films prepared by magnetron sputtering, after measuring the profile of the substrate before and after the coating, the stress distribution in the Zr film was calculated and the relationship between the work pressure, Zr film thickness and residual stress was studied. The results show that it is mainly uneven compressive stress in the Zr thin films. Work pressure has little effect on the residual stress of Zr thin films. Thickness of Zr thin films has greater influence on the residual stress, with increase of thickness, film stress decreases.