摘要
采用附加恒温电路对振荡器进行温度补偿 ,进而实现了低温漂。在结构设计上摒弃了传统的复杂恒温槽结构 ,改为对管壳封装的集成 VCO进行局部恒温 ,讨论了对温度漂移有影响的关键因素。通过合理设计 ,达到了要求的技术指标 ,实现了小型化。
To realize low frequency drift in oscillator circuits,constant temperature controlled circuit for temperature compensation is adopted.In structure designing,partial constant temperature to packaged integrated VCO is employed,instead of constant temperature tank structure.The key factors influenced on frequency drift are introduced.With logical design,we obtained expected specification and realized miniaturization.
出处
《半导体情报》
2000年第3期58-61,共4页
Semiconductor Information