摘要
介绍了 3- D MCM的四种封装模式的应用实例 ,详细讨论了各种模式的工艺 ,优点及存在的问题。 3-D MCM是未来微电子封装的发展趋势。
The applications of four modes of 3 D MCM packages are presented, including their manufacture technologies, advantages and existing problems. It is concluded that 3 D MCM is the trend of microelectronical package. (6 refs)
出处
《电子元件与材料》
CAS
CSCD
2000年第4期28-32,共5页
Electronic Components And Materials
