中小功率CO_2激光的厚板切割技术

The Technology of CO_2 Laser Bean with Middel/low power Cutting Thick Plates

分析了激光厚板切割技术的能量平衡和技术难点 ,具体介绍了几种厚板切割新技术 ,包括预热法、散焦法、激光锯切法、双聚焦法。并从工艺角度分析了几种切割技术的优缺点。

The energy balance and technical problems in Laser cutting of metal plates are analyzed in this paper.Some newlydeveloped processes of cutting thick plates are introduced,including the burnoff stabilized laser beam oxygen cutting,lasox,laser beam sawing with adaptive optics and dualfocus,which advantage and disadvantages are analyzed from the technological point of view.