中波HgCdTe光导探测器组件的故障树和失效研究

Study on HgCdTe Detector Assemble Fault Tree and Failure Analysis

讨论了近室温工作的HgCdTe中波光导探测器组件的可靠性问题,包括组件封装失效、引线键合失效和探测器的性能衰减等。通过收集探测器组件的失效信息,对其失效物理化学机制、制造工艺和探测器参数进行了分析,建立了组件的故障树(FTA),为探测器组件的失效分析提供了理论依据。由FTA定性分析得出探测器组件FTA的最小割集;计算了顶事件的失效几率。通过计算底事件概率重要度,得出组件封装失效是探测器组件失效的主要故障途径;同时实验发现,失效组件探测器的少子寿命值有较大的衰减,这可能起源于失效探测器的表面钝化层退化。

Discussed are the reliability problems of HgCdTe（MCT） infrared photoconductive detectors working at near room temperature,including package failure,chip bonding failure and performance attenuation.Based on collecting the failure data of the detectors,fault tree analysis（FTA） was built by analyzing the failure mechanism of physics and chemistry,manufacturing process and parameters of the detectors.Minimal cut sets of FTA were obtained from qualitative analysis and the failure probability of top event was calculated.The failure modes in detectors,structures and process were analyzed.