对冷拉拔铜锡合金导线显微组织的分子动力学模拟

Molecular Dynamics Simulation for Microstructure of Cold-Drawn Cu-Sn Alloy Conductor

利用等温等体积的分子动力学(NTV-MD)及均方根位移和径向分布函数研究了铜锡合金中的锡在铜基体中的存在形式和分布,并进行了试验验证。结果表明:锡以固溶的的形式分布于铜基体中,有可能形成铜锡中间相Cu_6Sn_5,但锡在铜基体中没有发生团聚现象;试验结果验证了分子动力学模拟的准确性。

By means of constant temperature and constant volume molecular dynamics, square displacement and radial distribution function, the microstructure, existence form and distribution of Sn in Cu substrate were studied, and the experimental test was performed. The results show that Sn solid soluted in Cu substrate and probably formed to intermediate phase of Cu6 Sn5, but the agglomerate phenomena for Sn in Cu substrate had no appeared. The accuracy of the model dynamics simulation were tested by the experimental results.