摘要
利用单棍快淬工艺制备快速凝固态Sn-6．5Zn合金薄带，对比分析快速凝固制各工艺对钎料微观结构、熔化与铺展特性的影响，并利用拉伸一剪切试验对比研究了钎料／Cu焊点力学性能。结果表明：快速凝固能够显著细化Sn-6．5Zn合金微观组织，初生β-Sn相快速分枝并形成网状枝晶结构，Zn相呈尺寸为0．5-2μm的细小颗粒分布于β-Sn基体中；经快速凝固后，Sn-6．5Zn合金熔化区间减小了约3．7℃；快速凝固态Sn-6．5Zn合金具有优于常态钎料的钎焊工艺性能，能够促进钎料／Cu焊点形成均匀界面并改善力学性能。
The rapidly solidified Sn-6.5Zn alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process on the microstructure, thermodynamic characteristic and spreading properties of Sn-6.5Zn solder alloys were analyzed. The tensile-shear tests were used to evaluate the mechanical properties of solder/Cu joints. The results show that the rapid solidification process can greatly refine the solidification structure of Sn-6.5Zn alloy. A netlike dendrite structure is formed due to the rapid branch of β-Sn and the Zn phases are distributed in β-Sn matrix in granular form with size of 0.5-2 μm. After rapid solidification, the pasty range is reduced by about 3.7 ℃. The rapidly solidified Sn-6.5Zn alloy has an excellent wettability under test compared with as-solidified solder. The mechanical properties of solder/Cu joints are also obviously improved by using the rapidly solidified Sn-6.5Zn solder alloy, which results in the formation of uniform interface.
出处
《中国有色金属学报》
EI
CAS
CSCD
北大核心
2012年第10期2805-2810,共6页
The Chinese Journal of Nonferrous Metals
基金
国家自然科学基金资助项目(50675234)
关键词
快速凝固
Sn-6
5Zn钎料
焊点
微观结构
力学性能
rapid solidification
Sn-6.5Zn solder
soldering joint
microstructure
mechanical properties
