连铸坯振痕与表面质量

Oscillation mark and surface quality of CC bloom

本文通过分析振痕形成的机理，阐述了振痕对铸坯表面质量的影响，以寻求减小振痕深度，提高铸坯表面质量，使其不需进行表面清理来实现连铸坯热装或直接热送的工艺要求。

On the analysis of oscillation mark formation mechanism , its effect on CC billet surface quality is pointed out to reduce oscillation mark depth, improve CC surface quality and meet requirement of CC billet hot charging or hot delivery without surface cleaning.