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化学镀Al_2O_3/Cu复合粉烧结体的组织研究

Study of sintering microstructure of Al_2O_3/Cu composite powders by chemical plating
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摘要 采用化学镀法制备了Al2O3/Cu复合粉体,将复合粉体在160MPa的压力下保压5min压制,在1 000℃保温1h、N2保护烧结,得到体积分数为50%的Al2O3P/Cu复合材料。通过SEM对复合粉体的形貌和复合材料的断口进行观察,通过光学显微镜对复合材料组织进行观察,通过能谱仪对复合材料中颗粒和基体的界面进行成分分析,并对其密度和热膨胀系数进行测定,结果表明:复合材料中Al2O3颗粒分布均匀,与Cu基体结合良好;复合材料相对密度为88.6%,100~300℃的热膨胀系数在(8.7~14.3)×10-6/K之间。 Al2O3/Cu composite powders were prepared by chemical plating. The 50vo1% Al2O3/Cu composite can be obtained by means of compaction at 160 MPa pressure for 5 min and then sintefing at temperature of 100℃ for lb. The morphology of the composite powder and the fracture of the composite were analyzed by SEM. The microstructure of the composites was observed by OM. The element distribution in interface between powder and matrix was investigated by EDS. The density and the thermal expansion were measured. The result shows that Al2O3/Cu powders are well combined with Cu matrix and uniformly distribute in composites. The composite has relative density of 88.6% and the thermal expansion coefficient of (8.7-14.3) × 10^-6/K in 100-300℃.
出处 《粉末冶金技术》 CAS CSCD 北大核心 2012年第5期348-352,362,共6页 Powder Metallurgy Technology
基金 内蒙古工业大学校基金资助项目(X200822)
关键词 化学镀 Al2O3 Cu复合粉体 AL2O3P CU复合材料 组织 chemical plating Al2O3/Cu composite powder Al2O3/Cu composite sintering microstructure
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