摘要
针对密闭式电子设备的热分析问题,建立了工程理论和数值方法相结合的分析模型。针对算例设备,通过仿真和试验对比,验证了建模及分析方法的有效性。分别研究了两种传热结构型式,以及硅脂导热系数和环境温度等参数对设备CPU和密封壳体表面温度的影响。计算结果表明:密闭空间内热量传递路径和方式对于设备温度分布有重要影响,但对壳体温度无影响,增加硅脂导热率可降低CPU温度,环境温度线性影响CPU和设备壳体表面温度。
An analysis method combined with theory and numerical method was established to study the thermal problem of the closed electronic systems. Validated with the experimental data, an acceptable accuracy was obtained. The effects of two alternative thermal conduct paths, silicone grease thermal conductivity and environmental tempera- ture on thermal distributing were studied. The results show that the thermal conduct path has a significant effect on thermal distributing, while no effect on shell temperature is found, a higher silicone grease thermal conductivity can reduce the temperature of CPU; the environmental temperature has a linear effect on the temperature of CPU and shell.
出处
《计算机仿真》
CSCD
北大核心
2012年第11期416-419,共4页
Computer Simulation
关键词
密闭电子设备
热分析
数值方法
Closed electronic systems
Thermal analysis
Numerical method
