摘要
共晶焊是微电子组装技术中的一种重要焊接工艺,在混合集成电路中得到了越来越多的应用。文中简要介绍了共晶焊接的原理,分析了影响薄膜基板与芯片共晶焊的各种因素,并且选用Ti/Ni/Au膜系和AuSn焊料,利用工装夹具在真空环境下通入氮、氢保护气体的方法进行薄膜基板芯片共晶焊技术的研究。
Eutectic is an important technology of micro-electronics assembly. It is more and more used in hybrid circuit. This paper describes briefly Principle of eutectic,and analyzes factors influencing on chip eutectic technology of thin film substrate .It uses Ti/Ni/Au film and AuSn solders,also designs fixture and studies chip eutectic technology of thin film substrate by importing nitrogen and hydrogen shielding gas in vacuum atmosphere.
出处
《电子元器件应用》
2012年第10期21-25,共5页
Electronic Component & Device Applications
关键词
共晶焊
空洞
剪切强度
接触电阻
eutectic
void
shear strength
contact resistance
