摘要
基于金属圆筒和高分子材料封装对光纤光栅的应力响应的增敏作用,设计了一种新的光纤光栅传感器结构,推导出了该传感器的压力增敏的数学模型,给出了该传感器的压力灵敏度系数与封装高分子材料参数和结构尺寸参数之间的数学表达式,通过实验测出其压力灵敏度为-5.02×10-3/MPa,比裸光纤光栅的压力灵敏度(-2.78×10-6/MPa)提高了1 800倍.对于这种基于金属圆筒和高分子材料封装结构的应力增敏模型,通过调节金属圆筒的尺寸、高分子材料的直径、杨氏弹性模量、泊松比等参数可方便地改变和调整传感器的压力灵敏度,以适应不同的场合.
Based on effect of FBG stress sensitivity enhancement by encapsulating the FBG with polymer and metal cylinder, a novel high-sensitivity FBG pressure sensor structure was designed and its mathematical model for calculating the pressure sensitivity was established. The experimental pressure sensitivity coefficient of the sensor （Kp） is -5.02×10^-3/MPa, which is 1 800 times of that of the bare FBG. The pressure sensitivity coefficient can be enhanced by properly selecting the size of metal cylinder and the parameters of the polymer such as the Yong＇ modulus and Poisson＇ ratio.
出处
《武汉大学学报（理学版）》
CAS
CSCD
北大核心
2012年第5期411-414,共4页
Journal of Wuhan University:Natural Science Edition
基金
国防预研基金项目(51402030205JB11)
关键词
光纤光栅
聚合物封装
应力增敏
压力灵敏度
fiber grating
polymer package
stress sensitivity enhancement
pressure sensitivity
