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掺氧多晶硅(SIPOS)薄膜结晶学性质研究

Crystallographic Study of Polysilicon Doped with Oxygens
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摘要 本文用XRD,RHEED和SEM对LPCVD掺氧多晶硅的结晶学性质进行了研究.结果表明,对于含氧量为8~37at%预淀积SIPOS薄膜其结构呈无定形.当进行高温热退火(T_a≥900℃)时,薄膜经历了一个再结晶过程.晶粒度的大小与退火条件有关;而修氧多晶硅中的含氧量对再结晶过程具有抑制作用. X-ray diffraction, high-energy electron diffraction and scaning electron microscope were used to study the crystallographic properties of doped-oxygen poly-silicon films obtained by LPCVD. The as-deposited films having a range of oxygen content from 8at% to 37at% appeared amorphous. Heat annealing processes (Ta≥900℃) caused recrystal growth. The size of the silicon crystalline formed in the silicon phase by heat-treatment was related to the annealing temperature, and the oxygen content suppressed observable grain growth during anealing.
出处 《固体电子学研究与进展》 CAS CSCD 北大核心 1990年第4期364-368,共5页 Research & Progress of SSE
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参考文献2

  • 1王云珍,蒋长根.用AES和XPS技术研究半绝缘多晶硅薄膜[J]半导体学报,1986(06).
  • 2王云珍,钮建昌.掺氧多晶硅薄膜退火特性的研究[J]华东师范大学学报(自然科学版),1985(03).

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