摘要
将芯片简化为层合板,基于弹性力学的多层板弯曲理论,通过求解板弯曲微分方程,得到芯片在自由边界约束条件下的温度翘曲变形的解析表达式。该芯片翘曲变形表达式可以反映材料参数随温度的变化,为再流焊温度变化幅度较大的芯片翘曲分析提供了有效的快速计算方法。通过与有限元分析计算结果及实测结果的对比,表明理论计算结果基本符合实际情况,层合板简化模型近似程度可以满足工程预估分析的要求。
Simplified the chip as laminated plate,solve the differential equation based on the theory of elastic mechanics of lamination theory;get the analytical expression of thermal warpage of chip in free boundary constraint conditions.The expression can reflect the change of the material parameter with temperature,provides an effective calculation method for the analysis of chip warpage with large changing temperature of soldering reflow.Through the comparison of the finite element analysis and measured results,it is showed that the theoretical calculation results are basically tally with the actual situation;the simplified model can meet the engineering prediction analysis requirements.
出处
《电子工艺技术》
2012年第6期330-334,共5页
Electronics Process Technology
基金
2011产学研合作基金项目
关键词
层合板
温度
翘曲变形
Laminated plate
Temperature
Warpage
