金属基覆铜板热阻影响因素及测试方法
摘要
本文通过讨论装联了芯片的金属基板的简单热模型，分析金属基板的热传导要素对热模型的影响和介质层热导率的测试方法。
出处
《印制电路资讯》
2012年第6期99-104,共6页
Printed Circuit Board Information
参考文献9
-
1Chung, Predicting maximum Enclosure Temperature, machine Design , P 101-107, 1987.
-
2KeynellM, Avionics Integrity Program, U.S. Air Force, 1990.
-
3Mil-HDBK-251 Reliab~ty/Design Thermal applications, Department of defense, U.S. 1978.
-
4史晓峰.提高晶体管稳态热阻测量精度的经验[J].电子标准化与质量,2001(6):40-42. 被引量：1
-
5Y. G. Kim, "Folded Staked Package Development, Proceedings of 52ndElectronic Components and Technology Conference, 2002, pp. 1341-1346.
-
6F. N. Masana, "A closed form solution of junction to substrate thermal resistance in semiconductor chips, " Ieee Transactions on Components Packaging and Manufacturing Technology, Dec 1996 , pp. 539-545.
-
7Yonemura N., Fukuda M, "Heat analysis on Insulated metal substrate" , leee, 1996.
-
8Sakamoto, " Thermal Design and Structure of Thick Film Hybrid IC base on Insulated Metal Substrate" Ninth SEMI-THERM symposium 1993.
-
9Jorda X, Perpifina X, Vellvehi M and Godignon P2006 Determination of the parasitic inductances in IGBT power modules Proc. 11th Electronique de Puissance du Fumr(EPE), Grenoble (France).
-
1杨希平.第五代组装技术与金属基覆铜板[J].广东电子,1998(10):34-34.
-
2本刊编辑部.覆铜板文摘与专利(9)[J].覆铜板资讯,2011(4):30-34.
-
3金属基覆铜板的行业标准开始制订[J].覆铜板资讯,2009(5):3-3.
-
4祝大同.日本散热基板业的新动向[J].覆铜板资讯,2012(1):8-13. 被引量：5
-
5金属基覆铜板新技术的发展[J].电子电路与贴装,2007(2):112-112.
-
6刘熙.高导热金属基覆铜板生产工艺控制要点[J].印制电路信息,2013,21(S1):28-31.
-
7祝大同.搭载LED的白色覆铜板用PEEK薄膜——特殊性能CCL的发展综述之四[J].印制电路信息,2009,17(1):20-24.
-
8加伸线路板LED铝基板销势旺盛[J].印制电路资讯,2009(5):54-54.
-
9本刊编辑部.金属基覆铜板等两项覆铜板CPCA标准表决稿得到通过[J].覆铜板资讯,2016,0(3):42-42.
-
10康敏成.PWB的近期发展动向及其应用[J].电子元器件应用,2001,3(1):1-5.
