小麦碾皮制粉各道碾皮状况的电镜观察与分析

Scanning and Analysis on Debranning State in Debranned Wheat Flour Milling

对小麦碾皮制粉各道碾皮麦的横切面、纵切面及表面进行电镜观察 ,分析各道碾皮麦皮层去除状况 ,为小麦碾皮制粉技术中碾皮率的确定提供理论依据。原料为红皮软质春小麦 ,采用擦离与碾削相结合方式进行小麦碾皮。经过四道碾皮后 ,其碾皮率达到 5%。电镜扫描显示 :头两道碾皮主要碾除了麦粒的表皮以及部分内果皮、种皮。第三道碾皮主要碾除了麦粒的种皮及部分珠心层。经第四道碾皮后 ,除麦粒腹沟处有部分皮层未被碾除 ,麦粒表面大部分露出糊粉层 ,但未损伤胚乳。

The debranning state of wheat grain,grain cross section,grain longitudinal section as well as grain surface,in each pass of wheat debranning were scanned with HITACH Scanning Electron Microscope S-450 and analysed,which offers a guide for laying down the debranning rate for debranned wheat flour milling.With the combination of frictional and abrasive debranning,the spring soft red wheat was debranned by 4 passes of debranning,with a total 5% debranning rate.The first two passes of debranning mainly debranned the cuticle and partially debranned the endocarp and episperm of wheat grain.The third pass debranned the episperm and a part of nucellar layer.After the forth debranning,only a little of cuticle at the crease was not debranned,most of the aleurone of wheat grain was exposed,but the endosperm of wheat grain was not demaged.