革命性的框架封装解决方案

The Introduction of Molded Interconnected System

MIS框架是基于电镀堆积和预塑封技术的框架制作工艺,基于预塑封料的底部支撑和电镀掩膜的密间距和延伸特性,决定了其对于Chip On Lead和Flip Chip等产品具有独特的优势,并已对QFN/QFP/BGA等传统封装方式形成了强而有力的竞争。

MIS is a LF manufacturing solution based on pre-mold and plating stack up technology. Solid supported by pre-mold compound and fine pitch film flexibility demonstrated unique advantage over COL and FC semiconductors. MIS package has formed a strong market competition to traditional QFN/QFP/BGA packages.