等离子喷涂热障涂层逐道沉积累积应力的模拟

Simulation on Stress Accumulation during the Path-by-path Deposition Process of Thermal Barrier Coating by Plasma Spraying

运用ANSYS12.0软件,对等离子喷涂热障涂层逐道沉积过程中的累积应力进行了有限元模拟。结果表明,涂层制备过程中,已喷涂层的温度随喷枪移动呈周期性大幅波动,这种快速热冲击使得涂层中产生了相应的应力波动。涂层喷涂结束并冷却至室温后,边缘存在应力集中,陶瓷层与粘结层的界面边缘处最大切向拉应力为122 MPa。涂层各界面中部应力值呈波浪状周期性浮动,X方向应力是主要的应力形式。

Finite element simulatin on stress accumulation during the path-by-path depositin process of thermal barrier coating by plasma spraying was performed by FEM software ANSYS12.0. During the spraying process, the temperature of the deposited coating fluctuates with the movement of the spraying gun periodically within a wide range. This rapid thermal shock will cause a corresponding stress fluctuation. After the coating being cooled to the room temperture, concentrated stress appeared at the edge of the coating, the maximum shear tensile stress existed at the edge of the interface between the ceramic layer and the bonding layer is 122 MPa. Stress at the middle of the interfaces of the coating fluctuates periodically like a wave and stress in the X direction is the major stress.