摘要
采用化学气相淀积 ( CVD)淀积 Si C薄膜中 Si H4、CH4的分解反应方程对 Si H4、CH4的分解产物种属进行数学建模 ,并结合相关热力学数据进行计算机模拟 ,得出 Si H4分解产物中以 Si H2 为最多 ,CH4以 CH2 为最多 ,表明它们在淀积薄膜中是主要因素。
The decomposing mechanism of SiH 4 and CH 4 in nc SiC film by CVD was discussed.After the reaction equations were determined by collecting previous chemical data, the computing simulation was carried out. The results show that the SiH 2 and CH 2 are main factors in deposition of nc SiC films.
出处
《计算机与现代化》
2000年第3期21-25,40,共6页
Computer and Modernization