高银含量银包铜粉镀层结构及性能研究

Plating Layer Structure and Property of Silver-Coated Copper Power with High Silver Content

采用化学镀法制备具有高银含量、一定厚度、致密性好的银包铜粉,用SEM、XRD、粒度分布仪、数字欧姆表和差热分析仪表征了镀银铜粉和原始铜粉的表面形貌、表面结构及导电性能。结果表明:高银含量银包铜粉表面镀层致密性好、包覆完全,包覆层厚度达到336nm,同时具有较好的导电性和抗氧化性。

The silver-coated copper powder with high silver content,a silver layer of certain thickness and high density was prepared by chemistry plating reaction.The surface morphology,structure and conductivity of the coated powder and the initial powder were characterized by SEM,XRD,LSPSDA,DOM and TG-DTA.Results show that the surface of the silver-coated copper power with high silver content is dense and coated completely,and the coating thickness is up to 336 nm.The powder has good conductivity and oxidation resistance.