摘要
本文探讨了CuZnAl,CuZnAlMn合金的弹簧试样在相变热循环过程中双程记忆性能的变化规律,表明引起铜基形状记忆合金双程记忆性能衰减的主要因素是由于位错增殖;在有外加应力条件下热循环时,还要考虑应力诱发马氏体对记忆性能的贡献。少量Mn的加入使CuZnAl合金在热循环过程中位错增殖加速,同时使应力诱发马氏体容易产生,结果导致在有外加应力条件下热循环时Mn能缓和记忆性能的衰减。
In this paper, the spring specimens of CuZnAl and CuZnAlMn alloy are chosen for the investigation of the transformation thermal cycling behaviour. The study shows that the main reason for the memory effect degradation of Cu-based alloys is dislocation multiplication. In addition, the benefit of the stress-induced martensite to the shape memory effect must be considered in the thermal cycling process with an applied stress. The addition of quarternary element Mn acoeralates dislocation multiplication, and meanwhile makes it e-asy to form stress-induced martensites in the thermal cycling process consequently it eases the degradation of two way shape memory effect in the thermal cycling process with applied stresses.
