ABS塑料化学镀铜的研究

Study of electroless copper plating on ABS plastic

以ABS塑料为基体,甲醛为还原剂,EDTA为络合剂,研究了化学镀铜的基本工艺。考察镀液的pH值、温度、时间对镀铜的影响,确定最佳工艺参数为pH=12.5、T=50℃、t=40min。通过扫描电镜和X射线衍射分析了最佳条件下镀铜层的形貌和成分,结果表明:该镀层外观红亮,表面平整,杂质含量很少。

The basic process of electroless copper plating was discussed using ABS plastic as a matrix, formaldehyde as a reducing agent and EDTA as a complexing agent. It was sudied for the bath pH, plating temperature and plating time. The optimum process parameters were identified that they were temperature being 50℃, the optimum pH value being 12. 5 and plating time being 40 min~ the composition and morphology of the copper layer under optimal conditions were analyzed by X-ray diffraction and SEM. The results showed that：the copper coating-was hongliang appearance,surface roughness,and few impurities.