期刊文献+

低熔点金属/聚乙烯复合体系的密炼加工行为及导电性能 被引量:2

Internal Mixing Behavior and Electrical Conductivity of Low-Melting-Point Metals/Polyethylene Composites
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摘要 通过密炼机将低熔点金属与聚乙烯熔融混合;研究了复合体系中金属粒子的尺寸与混合时间、转子转速、金属含量之间的关系,以及这些因素对复合材料体积电阻率的影响。结果表明,当金属的体积分数高于0.65%或混合时间超过5min时,可观察到金属液体聚集析出;当金属的体积分数为0.65%且混合时间为5 min时,金属液体聚集析出不明显。金属粒子尺寸随混合时间延长而先减小、再增大;随转子转速增加而先减小、然后趋于稳定;随金属含量增加而先增大后减小。复合材料的体积电阻率也受上述三个因素的影响,但密炼时间、转子转速对体积电阻率的影响应归咎于金属粒径的影响。 The low melting point metals (SnCu alloy and Sn ) and HDPE were mixed through the internal mixer. The effects of mixing time, rotary speed and Sn content on average diameter of Sn particles and volume resistivity were studied. It is found that low-melting-point metals assemble and separate out partly in the case of metal volume fraction above 0.65 % or mixing time above 5 min. When metal volume fraction is 0.65 % and mixing time is 5 rain, the assembling becomes unobvious. The average diameter of Sn particles in composite decreases early and then increases with the increase of mixing time, decreases early and then becomes invariant with the rotary speed increasing, and increases early and then decreases with the Sn content increasing. These factors also affect the volume resistivity of Sn/HDPE composite, but the effects of mixing time and rotary speed on volume resistivity are attribute to the effect of Sn particles size in composites.
出处 《高分子材料科学与工程》 EI CAS CSCD 北大核心 2012年第12期110-113,117,共5页 Polymer Materials Science & Engineering
基金 国家自然科学基金资助项目(51073143) 中国工程物理研究院科学技术发展基金(2010B0302037)
关键词 低熔点金属 高密度聚乙烯 密炼混合行为 体积电阻率 low-melting-point metals HDPE internal mixing behavior volume resistivity
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参考文献9

  • 1Motlagh G H, Hrymak A N, Thompson M R. Properties of a carbon fined cyclic olefin copolymer [ J ]. Journal of Polymer Science, B, 2007, 45(14) : 1808-1820.
  • 2Zhang X W, Pan Y, Cheng J F, et al. The influence of low- melting-point alloy on the rheological properties of a polystyrene meh [J]. Journal of Material Science, 2000, 35(18): 4573-4581.
  • 3熊传溪,万影,闻荻江.液态锡及锡铅合金对聚丙烯的促流作用[J].中国有色金属学报,1999,9(2):268-272. 被引量:6
  • 4Michaeli W, Pfefferkorn T G. Electrically conductive thermoplastic/ metal hybrid materials for direct manufacturing of electronic components[J]. Polymer Engineering and Science, 2009, 40(7): 1511-1524.
  • 5Bormashenko E, Sutovski S. Development of novel binary and ternary conductive composites based on polyethylene, low-inching- point metal alloy and carbon black[J]. Journal of Thermoplastic Composite Materials, 2004, 17(3): 245-257.
  • 6YuanZ F, Mukai K, Takag! K: Surface tension and its temperature coefficient of molten tin deter mined with the sessile drop method at different oxygen par'dal pressures[J]. Journal of Colloid and Interface Science, 2002, 254(2): 338-345.
  • 7吴爱民,孙载坚,吉法祥.确定固体聚合物表面张力方法的研究[J].中国塑料,1999,13(4):87-92. 被引量:10
  • 8Ganearz T, Moser Z, Gasior W, et al. A comparison of surface tension, viscosity and density of Sn and Sn-Ag alloy using different measurement techniques [ Thermophysics, 2011, 32(6) J ]. International Journal of 1210-1233.
  • 9吴其晔,巫静安,温学明,王新,李鹏,王淑英.聚乙烯熔体的挤出畸变与非线性粘弹性的关系[J].中国塑料,2004,18(7):40-44. 被引量:1

二级参考文献17

  • 1吴爱民,孙载坚.悬滴法高分子熔体界面张力测量仪[J].中国塑料,1994,8(2):47-52. 被引量:7
  • 2Wu S,高聚物界面与粘合,1984年
  • 3Wu S I,Polymer Blends Panl,1978年
  • 4Wu S J,Macromol Sci C,1974年,10期,1页
  • 5Wu S,J Polym Sci C,1971年,34卷,19页
  • 6Wu S,J Phys Chem,1970年,74卷,632页
  • 7熊传溪,Trans Nonferrous Met Soc China,1999年,9卷,2期
  • 8熊传溪,材料导报,1998年,12卷,3期,69页
  • 9熊传溪,武汉工业大学学报,1998年,13卷,4期,36页
  • 10Zhao F,武汉工业大学学报,1996年,11卷,2期,38页

共引文献12

同被引文献27

  • 1贺江平,唐明静,王宪忠,等.不同加工条件下Sn-Cu/HDPE复合体系中填料相的形态特点[c]//中国化学会.2008年全国高分子材料科学与工程研讨会论文集.贵阳,2008:520.
  • 2A Boudenne, L Ibos, M Fois, et al. Electrical and Ther- mal Behavior of Polypropylene Filled with Copper Particles [J]. Composites.. Part A, 2005, 36:1545-1554.
  • 3Yc P Mamunya, V V Davydenko, P Pissis. Electrical and Thermal Conductivity of Polymers Filled With Metal Pow ders[J]. European Polymer Journal, 2002, 38: 1887-1897.
  • 4S G Halit, J F Thomas, D M Kalyon. Effects of Particle Shape and Size Distributions on the Electrical and Magne- tic Properties of Niekel/Polyethylene Composites [J].Journal of Applied Polymer Science, 1993, 50 : 1891 -1901.
  • 5I K Bishay, S L Abd El Messieh, S H Mansour. Electri cal, Mechanical and Thermal Properties of Polyvinyl Chlo- ride Composites Filled with Aluminum Powder[J]. Mate- rials and Design, 2011, 32:62-68.
  • 6X Lu, G Xu. Thermally Conductive Polymer Composites for Electronic Packaging[J]. Journal of Applied Polymer Science, 1997, 65:2733 -2738.
  • 7J S Sun, H S Gokturk, D M Kalyon. Volume and Suriace Resistivity of Low-density Polyethylene Filled with Stain less Steel Fibres[J]. Journal of Materials Science, 1993, 28: 364-366.
  • 8J F Feller, S Roth, A Bourmaud. Conductive Polymer Composites: Electrical, Thermal, and Rheological Study of Injected Isotactic Poly(propylene)/Long Stainless Steel Fibers for Electromagnetic Interferences Shielding [J 1. Journal of Applied Polymer Science, 2006, 100: 3280-3287.
  • 9D M Kalyon, E Birinci, R Yazici. Electrical Properties of Composites as Affected by the Degree of Mixedness of the Conductive Filler in the Polymer Matrix[J]. Polymer En- gineering and Science, 2002, 42(7) : 1609-1617.
  • 10Varij Panwar, V K Sachdev, R M Mehra. Insulator Con- ductor Transition in Low density Polyethylene-graphite Composites[J]. European Polymer Journal, 2007, 43:573-585.

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