摘要
使用Icepak热分析软件对某电子设备散热器进行优化设计,确定散热器的最佳外形尺寸;并根据模拟的风机流量推算实际机柜风机流量,选择合适的风机对机柜进行热分析,验证优化后散热器的散热能力。
Icepak-based thermal analysis software is adopted for optimized design of radiator of certain electronic equipment to determine the optimum size of the radiator. In addition, simulated fan flow is used to estimate the actual fan flow of cabinet; proper fan is selected for thermal analysis of cabinet; and heatsinking capacity of optimized radiator is verified.
出处
《建筑电气》
2012年第11期58-63,共6页
Building Electricity
关键词
Icepak热分析软件
风冷
电子设备热设计
Icepak-based thermal analysis software Air cooling Electronic equipment Thermaldesign
