脉冲电沉积法制备高P镍基合金镀层

PULSE ELECTRODEPOSITION OF NICKEL MATRIX ALLOY COATINGS WITH HIGH CONTENT OF PHOSPHORUS

研究了脉冲参数(脉冲高度、宽度、以及反向脉冲等参数)对Ni-P合金镀层P含量、微观形貌等特性影响的规律。结果表明,平均电流密度与反向脉冲电流密度对镀层的P含量有较大地影响;占空比、频率对镀层的微观形貌影响较大。与直流电沉积法制备的Ni-P镀层相比,在不改变镀液组成的条件下,脉冲电沉积法可以显著提高Ni-P合金镀层的P含量。

This paper discussed the influence of pulse parameters （pulse height, pulse width and reverse pulse variables） on the phosphorous content and morphology of Ni-P coatings. The result showed that both average current density and reverse anodic current density had a strong effect on the phosphorous content, whereas duty circle and frequency had great impact on the morphology of coatings. Compared with the Ni-P coatings prepared via direct current electrodeposition, pulse plating method increases the content of phosphorous without changing the composition of the solution.