摘要
系统级封装(System in Package,SiP)已经成为重要的先进封装和系统集成技术,是未来电子产品小型化和多功能化的重要技术路线,在微电子和电子制造领域具有广阔的应用市场和发展前景,发展也极为迅速。对目前SiP技术的研究现状和发展趋势进行了综述,重点关注了国际上半导体产业和重要的研究机构在SiP技术领域的研究和开发,对我国SiP技术的发展做了简单的回顾和展望。
System in Package （SiP） has become one of the most important advanced assembly and integrated technology. It is important technology roadmap of miniaturization and multi-function of electronic products in future. SiP has wide market in application and prospective development of microelectronics and electronics manufacture.This article is a brief description of current status and development trend of SiP technology. Especially this article focus on the research and development on SiP technology by international semiconductor industry and main institutes. Furthermore there is brief review and prospective on SiP technology development in our country.
出处
《电子工业专用设备》
2012年第11期1-6,31,共7页
Equipment for Electronic Products Manufacturing
关键词
系统级封装
技术发展
典型企业
研究机构
System in Package（SiP）
Technology development Typical enterprise
Research institute
