新型不带铜底板IGBT功率模块的散热设计

Thermal Spread Design for New Structure IGBT Module Without Base Plate

随着IGBT芯片功率密度的提高,在中小功率I GBT功率模块中,不带铜底板的I GBT模块已经成为模块封装发展的一个趋势。但是每一种新型结构的功率模块封装都有它的优缺点,新型的不带铜底板的功率模块,它的优点是体积小,重量轻,成本低;缺点是它的散热性能受导热硅脂性能和厚度的影响非常大。本文通过大量仿真及实验数据,详细描述了导热硅脂对不带铜底板模块散热性能的影响,并结合实验数据,介绍了Vi ncotech公司推出的预涂高性能导热硅脂服务对模块散热的改善效果。

With the development of IGBT chips, the power is becoming more and more concentrating. For small and medium power applications, new structure IGBT power module without base plate becomes popular. But for every new thing, there are two sides. The power module without base plate has the advantages of small size, light weight and low cost. But its thermal spread capability is very sensitive to the performance and thickness of thermal grease. The article introduces the influence on power module thermal performance with the different thermal greases at different thicknesses. Finally the pre-applied high performance thermal grease service from Vincotech is introduced. It achieves very good thermal performance improvement with very low cost.