一种低黏度环氧树脂室温固化体系的研究

Study on Low Viscosity Room Temperature Epoxy Curing System

用一种新的耐热型环氧树脂JEh-031研究了一种室温固化体系,通过凝胶化时间的测定和示差扫描量热仪(DSC)对固化体系的热性能和力学性能进行了研究;研究了活性稀释剂对浇铸体性能和玻璃纤维增强复合材料性能的影响。结果表明,添加4 phr固化剂(GH-3)时,该固化体系在室温(25℃)下凝胶化时间为10 h;力学性能优异,拉伸强度91.4 MPa,拉伸模量4.0 GPa,弯曲强度176.9 MPa,弯曲模量3.5 GPa;玻璃化转变温度(Tg)144.7℃;添加5 phr活性稀释剂,复合材料的弯曲强度1 322.5 MPa,提高了39.3%,层间剪切强度69.3 MPa,提高了23.1%。

A room temperature curing system with a new heat-resistant epoxy resin JEh-031 was studied. The thermal and mechanical properties of curing system were investigated by gelatinization test and DSC analysis in this research. The results showed that add 4phr curing agent （ GH-3 ）, curing system in room temperature （25 ℃ ） of the gelatinization time of 10 h. The mechanical performance was excellent with tensile strength about 91.4 MPa, tensile modulus 4.0 GPa, bending strength 176.9 MPa, bending modulus 3.5 GPa, the Tg 144.7℃. Adding 5 phr the reactive diluents, the composite bending strength was 1 322.5 MPa, increased by 39. 3% , and the interlaminar shear strength was 69.3 MPa, increased by 23.1%.