摘要
为了解决平板电源制备过程中所用片式多层陶瓷电容器(MLCC)的开裂问题,通过DPA(Destructive Physical Analysis)方法分析了MLCC在平板电源中的开裂模式。结果表明,主要开裂模式为弯曲开裂。通过将MLCC的材质由X7R调整为NPO,尺寸由1206改为0805,同时增加PCB板厚度并规范SMT安装方式,调整焊接工艺以及使用规范的成品检验方式等措施,可解决或者改善平板电源用MLCC的断裂现象,提高产品的可靠性。
In order to solve the crack problem of the multilayer chip capacitor（MLCC） occured in the production process of the flat panel power source,the crack mechanism was analyzed using the DPA method.The investigation results show that the main failure mechanism is the bending crack.The crack phenomenon is addressed by adjusting the materials of ceramic body from X7R to NPO,downsizing the component from 1206 to 0805,increasing the PCB thickness,normalizing SMT method,adjusting the welding procedures and standardizing product inspection.Meanwhile,the reliability and stability of the products are improved.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2013年第1期42-44,47,共4页
Electronic Components And Materials
