摘要
SKiN技术是使用烧结层替代焊接的新技术,通过无绑定线封装技术平台增强了可靠性、减小了热阻、并改进了内部寄生电感。本文介绍了采用该技术设计的功率模块的性能特点,并进行了样机测试。
Skin technology is a new one applying sintered layer instead of welding, which enhances reliability, reduces thermal resistance, improves internal parasitic inductance, through no-bond-wire encapsulation technology platform. The article introduces performance and features of the power module applying this technology, and demo test is conducted in the meantime.
出处
《电源世界》
2012年第12期44-46,50,共4页
The World of Power Supply
