摘要
针对功率半导体器件对高导热、绝缘热沉材料的需求,以高温高压法合成了金刚石/铜复合热沉材料,并沉积金刚石薄膜作为绝缘层。研究结果表明:当金刚石颗粒尺寸为80～120μm、金刚石体积百分含量为80%时,复合热沉热导率高达580 W/m·K,并且具有良好的绝缘性。金刚石/铜复合材料在高温高压(6 GPa,1 200℃)下形成了部分金刚石骨架作为有效导热通道。
Diamond/copper composites, on which diamond film was deposited as the insulating layer, were prepared by high temperature and high pressure （ HTHP ） sintering method, for the require ments of high thermal conductivity and insulation by power semiconductor devices. The results indicate that a high thermal conductivity value of 580 W/m · K could be achieved when diamond particle diameter is 80 - 120 μm and diamond volume percent is 80%. Part of diamond skeleton is formed as effective thermal channels under HTHP（6 GPa, 1 200 ℃ ）.
出处
《真空与低温》
2012年第4期210-214,共5页
Vacuum and Cryogenics
关键词
金刚石
铜复合热沉
热导率
有效导热通道
绝缘层
diamond/copper composites heat sink
thermal conductivity effective thermal channels insulating layer
