遥感相机复合材料底板的成型工艺研究

Study on process of the CFRP motherboard in remote sensing camera

简述了某型号遥感相机复合材料底板的组成。为提高相机底板的强度和刚度,经分析研究,通过合理选材和优化结构,在相机底板中设置了碳纤维复合材料整体加强框架,且采用轻质高强的蜂窝夹层结构,确保该制件轻量化的要求;同时,还对该制件成型工艺过程和技术难点进行分析。结果表明,研制成功的该制件经受地面试验和在轨运行试验,各项技术指标均满足设计要求,取得预期的成效。

This paper introduced the constituent of the CFRP motherboard in remote sensing camera. To improve the stiffness and strength of the motherboard, analysis on materials structure and so on were carried out. By choosing appropriate materials molding one integrative CFRP strengthened frame in the motherboard and adapting sandwich structure was able to make the motherboard meet the requirements for the lightweight and other performances. In addition, the forming technology and difficulty of this process were analyzed. The results show that the technical indicators of the successfully developed motherboard subjected to the ground tests and the onorbit tests met the design requirements and achieved the expected results.