摘要
在介绍半导体热熔型塑胶封装工艺流程的基础上,对于采用欧姆龙NJ系列高性能多功能一体化新型控制器的芯片封装设备研发,给出关键论题的多方案创新性研讨。
Based on the introduction of semiconductor hot-melt plastic encapsulation process, the R & D works of chip packaging equipments based on NJ Series high- performance multi-functional integration controllers from Omron are given. The innovative discussion about key technologies are presented
出处
《传感器世界》
2012年第12期38-43,共6页
Sensor World