3HARA Yasuhiko.Non destructive inspection technolo-gies used for electronic components and packages[].Journal of Japan Institute of Electronics Packaging.2001
4Munehiro Mandou et al."3-D Visual Inspection far Solder Side of Printed Circuit Board(Ⅳ)-Development of Inspection System for Printed Circuit"[].Technical report of Eastern Hiroshima Prefecture Industrial Research Institute No.1996
5."X-rays Expose Hidden Connections"[].Test and Measurement EUROPE.2001
