Ti-5Al-2.5Sn合金冷坩埚感应熔炼过程中Al和Sn元素的挥发研究

Evaporation of Al and Sn during ISM Process of Ti-5Al-2.5Sn Alloy

利用所建立的模型研究了Ti5Al25Sn合金感应凝壳熔炼(ISM)过程中Al、Sn元素的挥发控制方式,并在此基础上研究了熔体温度和真空室压力对Al、Sn挥发速率的影响。结果表明,实际熔炼条件下Al、Sn的挥发都由界面挥发反应单一控制,真空室压力对挥发速率的影响具有明显的临界值,当压力低于此临界值时,挥发速率几乎没有什么变化,而当压力高于此值时,挥发速率迅速降低。

With the established model, the evaporation controlling mode as well as the evaporation rate of Al and Sn during ISM process of Ti 5Al 2 5Sn alloy was studied The results show that the evaporation of Al and Sn is controlled by the evaporating reaction under the practical melting condition The effect of the vacuum pressure on the evaporation rate appears to have a critical value When the vacuum pressure is lower than the critical value, the evaporation rate does not change with the vacuum pressure, but when the vacuum pressure is higher than it, the evaporation rate decreases sharply to a minimum