期刊文献+

标准CMOS工艺新型多晶硅PIN-LED的设计与实现 被引量:3

Design and realization of a novel polycrystalline Si PIN-LED with standard CMOS technology
原文传递
导出
摘要 采用联华电子公司(UMC)0.18μm标准CMOS工艺设计并制备了多晶硅PIN-LED,测试结果表明,i区宽为10μm器件的正向导通电压为1.5V,反向击穿电压为8.8V;当其工作在正向载流子注入模式时发射950~1 250nm波段的红外光,工作在反向雪崩击穿模式时发射650~1 000nm波段的可见光。实验结果表明,本文以多晶硅材料制备的PIN-LED与单晶硅材料制备的Si-LED具有类似的电学特性与光学特性。 Abstract: Until now, the optical characteristics of poly-silicon have not been researched and utilized. In order to solve this problem,the PIN LED is designed and fabricated in the commercial standard 0. 18μm CMOS process which is offered by United Microelectronics Corporation (UMC) without any modifiea tion. Experimental results suggest that the forward and reverse breakdown voltages of the device, whose width of i region is 10μm,are 1.5 V and 8.8 V respectively. The spectrum ranges from 950 nrn to 1250 nm (the infrared band) when it works at the positive carriers injection mode,while ranging from 650 nm to 1000 nm (the visible light band) at the reverse avalanche breakdown mode. It includes three peaks in the infrared band,the wavelengths of the two main peaks are λ= 1110 nm (E=1. 12 eV) and λ=1 150 nm (E=1.08 eV),respectively,and the wavelength of the secondary peak is λ= 1 050 nm (E-1.18 eV). And there is only one main peak in the visible light band,whose wavelength is 730-780 nm (1.59 -1.70 eV). It is confirmed that the PIN-LED made by poly-silicon materials and the LED made by mono-crystalline materials have similar electrical and optical properties, after comparing the above exper imental data with the mono-crystalline's I-V characteristics and spectra which have already been reported.
出处 《光电子.激光》 EI CAS CSCD 北大核心 2013年第1期6-10,共5页 Journal of Optoelectronics·Laser
基金 国家自然科学重点基金(61036002)资助项目
关键词 多晶硅PIN—LED 标准CMOS工艺 发光 polycrystalline silicon PIN-LED standard CMOS technology light emission
  • 相关文献

参考文献6

二级参考文献76

共引文献10

同被引文献23

  • 1陈刚,陈雪兰,柏松,李哲洋,韩平.4H-SiC外延中的缺陷及其对肖特基二极管的影响[J].半导体技术,2008,33(S1):247-249. 被引量:2
  • 2孙旭光,张春,李永明,王志华,陈弘毅.超高频无源RFID标签的一些关键电路的设计[J].中国集成电路,2007,16(1):29-35. 被引量:14
  • 3姜兰举.肖特基二极管原理及应用[J].电子报,2008(6).
  • 4Meindl J D,Ohen Q,Davis J A. Limits on silicon nano- e- lectronics for terascale integration[J]. Science, 2001,293 (5537) :2044-2049.
  • 5Papichaya C, Delphine M M, Jacopo F, et al, Integrated germanium optical interconnects on silicon substrates[J]. Nature Photonics,2014 ,8(6) :482-488.
  • 6YAN Hai,FENG Xue,ZHANG Deng-ke,et al. Compact op- tical add-drop multiplexers with parent-sub resonators on SOl substrates[J]. IEEE Photonics Technology Letters, 2013,25(5) :1462-1465.
  • 7Plessis M D, Aharoni H, Synman L W. Two- and multi-ter-minal CMOS/BiCMOS Si LEDs[J]. Optical Materials, 2005,27(5) : 1059-1063.
  • 8Synman L W, Aharoni H, Plessis M D. A dependency of quantum efficiency of Silicon CMOS n+ pp+ LEDs on Cur- rent Density [ J]. IEEE Photonics Technology Letters, 2005,17 (10) : 2041-2043.
  • 9Snyman k W, Plessis M D,Belotti E. Photonic transitions (1.4 eV-2.8 eV) in silicon p+ np* injection- avalanche CMOS LEDs as function of depletion layer profiling and defect engineering[J]. IEEE Journal of Quantum Electron- ics, 2010,46 (6) : 906-919.
  • 10LEE Hsiu-chih, LEE Shyh-cheng, LIN Yi-pen, et al. Inter- face-trap-assisted emission in Si complementary metal- oxide-semiconductor light-emitting devices[J]. Japanese Journal of Applied Physics, 2005,44(6A) : 3867 -387 1.

引证文献3

二级引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部