摘要
用射频磁控溅射技术在双面抛光的石英玻璃(SiO2)基底上沉积Er3+/Yb3+掺杂的TiO2薄膜,利用RBS背散射分析技术和X射线衍射技术研究溅射压强对薄膜结构性质的影响。结果表明:随着压强增加,成膜速率缓慢下降,且压强增大到一定数值之后对成膜速率的影响会逐渐减弱;随着压强增加,薄膜晶粒变大,晶粒间界变小,晶化质量提高。当溅射压强2.0Pa时,晶粒尺寸最大为64nm;适当降低溅射压强有利于提高薄膜的沉积速率,但是压强值也不能过小,否则会影响薄膜的晶粒尺寸大小,降低薄膜的结晶质量。
Ti02 films are deposited on the double-sided polishing quartz glass （ SiO2 ） by rf magnetron sputtering technology. RBS and XRD are applied to study the structural properties of the films. Results show： the deposition rate and the grain boundary decrease with the increase of the sputtering pressure, and when the grain grows larger, this trend will gradually weaken as the pressure increases to a certain value; when the sputtering pressure is 2.0 Pa, the grain size reaches a maximum of 64nm; reducing the sputtering pressure is conducive to improve the film deposition rate, but the pressure value can not be too small, otherwise it will affect the grain size, reducing the quality of the crystallization of the film.
出处
《山东建筑大学学报》
2012年第6期575-578,共4页
Journal of Shandong Jianzhu University
基金
山东省自然科学基金项目(ZR2009FM031)
济南市科技局高校院所自主创新计划(OUT-02400)
关键词
TIO2薄膜
磁控溅射
溅射压强
沉积速率
晶粒尺寸
Er3 ＋/Yb3 ＋ -codoped TiO2
magnetron sputtering
sputtering pressure
deposition rate
grain size
