适用于硅晶体多线切割的线切割液研制

New Wire Cutting Fluid Suitable for Multi-wire Saw of Silicon Crystals

本文通过硅片旋转磨损试验模拟线切割过程,以评价切割液的切割性能。首先,通过对比试验选出线切割液的主要组份;接着,通过正交试验优化各组份的含量并得到最优配方;最后,在相同条件下将最优配方与某市场切割液进行比较。结果表明:自制最优配方切割液MRR为7820 nm/min,Ra为9.12 nm。与市场切割液相比MRR稍低,但表面粗糙度要好。分析原因是由于新配方切割液在分散性和润滑性方面有所提高,而且碱性变强,加大了化学作用,有效的提高了晶片表面质量。

In this paper,through the silicon wafer wear test simulation wire cutting process,to evaluate the liquid＇s cutting performance.Firstiy,selecting the main components of wire cutting fluid from the contrast experiment;then,optimizationing the content of the components by orthogonal experiment and optimal formula was obtained;finally,the optimal formula and a market cutting fluid were compared under the same conditions.The results showed that MRR was 7820 nm/min and Ra was 9.12 nm under the optimal formula.Compared with the market cutting fluid,MRR was a little less,but obtained better surface roughness.The reason is that new cutting fluid improved the dispersity and lubricity.More alkaline increased the chemical actions and effective improved the wafer surface quality.