半导体激光在鼓室成形术中的应用

The semiconductor diode laser application in tympanoplasty

目的 :探讨半导体激光在鼓室成形术中的应用。方法 :在鼓室成形术中运用激光处理听骨链或其周围病灶 14耳 ,术中激光操作主要用于锤砧骨与上鼓室骨性融合、听骨链周围的纤维瘢痕组织及切除锤骨头等。结果 :患者术后无眩晕、面瘫等并发症发生。术后听力提高平均为 2 4d B,气骨导差在 2 0 d B以内者 7耳 ( 5 0 % )。结论 :半导体激光在鼓室成形术中应用能有效减少对听骨链的触动 ,减少术野出血 。

Objective: To investigate the method, indications and initial results of semiconductor diode laser application in tympanoplasty.Method:The diode laser was used in 14 tympanoplasty procedures. The laser manipulation was mainly used in cases of malleus and incus bony fixation with the tympanum, the fibrous scar tissue around the ossicular chain and the malleus head resection.Result:There was no postoperative vertigo and facial paralysis. The average hearing improvement was 24 dB. Seven cases (50%) reached an airbone gap within 20 dB.Conclusion:The application of diode laser in tympanoplasty could effectively reduce the manipulation trauma of ossicular chain and control the bleeding of operative field, especially in managing the bony adhesion of the ossicular chain.