点状孔壁分离影响因素之探讨

Inquiring on impact factors for dotted hole wall pull away

文章通过单因素试验方法探讨了导致点状孔壁分离的影响因素,包括对膨胀过程的高锰酸钠浓度,镀铜后水洗温度,新旧镀液等影响因素的对比测试,统计出不同影响因素下的不合格率,优选出孔壁分离少的镀液参数。结果表明,化学镀铜后水洗温度为30℃和使用新配镀液对点状孔壁分离有很大改善作用。

The impact factors led to dotted hole wall pull away problems have been studied through the discussing of the single factor test in this article,including a comparison test of the influence factors of the expansion process of the concentration of NaMnO4,copper plating temperature after washing,old and new plating bath,the statistics of the failure rates under the different influence factors,preferably the parameters of plating bath with less hole wall separating defect.The result shows that it really makes big improvement when the washing temperature is 30℃ for Electroless Copper Plating and separating the dotted hole wall by using the new bath.