摘要
随着PCB行业的发展,细密线路大量出现、电路板的板面面积不断减少且电路板上要求贴装的电子元件不断增加。为增加电路板的板面利用率,将无源器件内埋,减少板面通孔以增强板面的布线能力的工艺应运而生。埋电阻板就是众多埋嵌工艺中的一种。
With the development of PCB industry,high density PCB with less area printed circuit board are increasing and the number of components on the board is increasing.In order to raise the utilization rate of the board,a process of buried the passive devices and reduced via hole is appearing.Buried resistance board is one of the many process.
出处
《印制电路信息》
2013年第1期35-38,共4页
Printed Circuit Information
关键词
内埋电阻
铜箔
蚀刻
Buried Resistance Board
Copper Foil
Etching