期刊文献+

Phase noise modeling in LC oscillators implemented in SiGe technology

Phase noise modeling in LC oscillators implemented in SiGe technology
原文传递
导出
摘要 This paper addresses phase noise analysis of a radiofrequency LC oscillator built around a SiGe heterojunction bipolar transistor (HBT) realized in a 0.35 um BiCMOS process, as an active device. First, we give a brief background to SiGe HBT device physics. The key point is to initiate quantitative analysis on the influence of defects induced during extrinsic base implantation on electric performances of this device. These defects are responsible for the current fluctuations at the origin of low frequency noise in BiCMOS technologies. Next, we investigate the effect of implantation defects as a source of noise in semiconductors on the phase noise of a radiofrequency LC oscillator. We observe their influence on the oscillator phase noise, and we quantify the influence of their energy distribution in the semiconductor gap. Second, we give a behavioral model of an LC oscillator con- taining a SiGe HBT as an active device. The key goal is to study the susceptibility of a radiofrequency oscillator built around a SiGe HBT to phase noise disturbance sources. Based on the time variance behavior of phase noise in oscillators, transient simulations (in the time domain) were used to analyze the time-dependent noise sensitivity of the oscillator. This paper addresses phase noise analysis of a radiofrequency LC oscillator built around a SiGe heterojunction bipolar transistor (HBT) realized in a 0.35 um BiCMOS process, as an active device. First, we give a brief background to SiGe HBT device physics. The key point is to initiate quantitative analysis on the influence of defects induced during extrinsic base implantation on electric performances of this device. These defects are responsible for the current fluctuations at the origin of low frequency noise in BiCMOS technologies. Next, we investigate the effect of implantation defects as a source of noise in semiconductors on the phase noise of a radiofrequency LC oscillator. We observe their influence on the oscillator phase noise, and we quantify the influence of their energy distribution in the semiconductor gap. Second, we give a behavioral model of an LC oscillator con- taining a SiGe HBT as an active device. The key goal is to study the susceptibility of a radiofrequency oscillator built around a SiGe HBT to phase noise disturbance sources. Based on the time variance behavior of phase noise in oscillators, transient simulations (in the time domain) were used to analyze the time-dependent noise sensitivity of the oscillator.
出处 《Journal of Semiconductors》 EI CAS CSCD 2013年第2期60-66,共7页 半导体学报(英文版)
关键词 SiGe heterojunction RADIOFREQUENCY mixed-mode simulations OSCILLATOR phase noise SiGe heterojunction radiofrequency mixed-mode simulations oscillator phase noise
  • 相关文献

参考文献17

  • 1Demir A, Mehrota A, Roychowdhury J. Phase noise in oscil.lators: a unified theory numerical method for characterization. IEEE Circuits and Systems, 2000, 47:655.
  • 2Razavi B. A study of phase noise in CMOS oscillators. IEEE J Solid-State Circuits, 1996, 31: 331.
  • 3Mitin V, Reggiani L, Varani L. Generation-recombination noise in semiconductors. Noise and Fluctuations Control in Electronic Devices, 2003:11.
  • 4Cressler J D. SiGe HBT technology: a new contender for Si- based RF and microwave circuit applications. IEEE Trans Mi- crow Theory Tech, 1998, 46:572.
  • 5Ramonas M, Sakalas P, Jungemann C, et al. Microscopic model- ing of high frequency noise in SiGe HBTS. 37th European Solid State Device Research Conference, 2007:183.
  • 6Hajimiri A, Lee T H. A general theory of phase noise in electrical oscillator. IEEE J Solid-State Circuits, 1998, 33:179.
  • 7Harame D L, Ahlgren D C, Coolbaugh D D, et al. Current sta- tus and future trends of SiGe BiCMOS technology. IEEE Trans Electron Devices, 2001, 48:2575.
  • 8Baudry H, Szelag B, Del6glise F, et al. BiCMOS7RF: a highly manufacturable 0.25 /zm BiCMOS RF applications dedicated technology using non-selective SiGeC epitaxy. IEEE Bipo- lar/BiCMOS Circuits and Technology, 2003:207.
  • 9Mouis M, Gregory H J, Denorrne S, et al. Physical modelling ofthe enhanced diffusion of boron due to ion implantation in thin base NPN bipolar transistors. Microelectron J, 1995, 26:255.
  • 10Militaru L, Souifi A, Mouis M, et al. Investigation of deep traps in silicon-germanium epitaxial base bipolar transistors with a single polysilicon quasi self aligned architecture. Microelectron Reliab, 2001, 41:253.

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部