纳米Ni颗粒对Sn0.65Cu亚共晶钎料润湿性和抗氧化性的影响

The Effcet of Nano-Ni Particles on the Wettability and Oxidation Resistance of Sn0.65Cu Hypoeutectic Solder

在Sn0.65Cu亚共晶钎料中掺入纳米Ni颗粒,研究其对钎料润湿性及抗氧化性的影响。当w(Ni)=0.1%时润湿力最大,为3.29mN,润湿时间为1.01s。随着Ni含量的增加(w(Ni)<0.7%)润湿力逐渐减弱,润湿时间增加。纳米Ni颗粒会增强钎料的抗氧化性,当w(Ni)=0.7%时抗氧化性最好。

After nano-Ni particles were mixed to Sn0.65Cu hypoeutectic solder, the wettability and oxidation resistance of solders were studied. When w（Ni） was 0.1% , the maximum wetting force was 3.29 mN and wetting time was 1.01 s. The wetting force was gradually weakened and the wetting time increased by increasing the content of Ni （ w（Ni） 〈0.7% ）. Nano-Ni particles enhanced the oxidation resistance of solders, when w（Ni） was 0.7% , the oxidation resistance of solders was the best.